METech 版 (精华区)
发信人: hitter (请稍后...涅磐中), 信区: METech
标 题: MEMS news (放点mems的好消息。)
发信站: 哈工大紫丁香 (2004年01月12日08:14:01 星期一), 站内信件
前一段时间总是看到mems的坏消息,今天终于看到了一个好消息。
好的bonding技术必将对mems和ic产生比较好的影响。
http://www.siliconstrategies.com/story/OEG20020823S0006
Ziptronix unveils 'breakthrough' bonding technology
RESEARCH TRIANGLE PARK, N.C.-- Ziptronix Inc., a spin-off from the Research Tr
iangle Institute, here introduced a new and 揵reakthrough' process that enable
s permanent, covalent bonding of semiconductor materials at room temperature w
ithout adhesives.
Ziptronix' technology, dubbed ZiROC, allows aligned wafer-to-wafer and die-to-
wafer bonding using standard process equipment in ambient fab conditions, acco
rding to the Research Triangle Park-based company.
The company's technology uses standard fab equipment and chemicals that can be
scaled to 300-mm processing. It allows the bonding to be achieved at a cost l
ower than traditional methods.
Initial applications include custom engineered substrates for temperature comp
ensation and other thermal management needs. It also enables wafer-scale, herm
etic encapsulation of MEMS and other surface-sensitive devices.
Combined with Ziptronix' post-bonding interconnect process, the technology ena
bles the 3D integration of existing devices and, ultimately, the fabrication o
f custom solid-state systems in 3D.
揙ur technology clears a new path to low-cost, high-performance system design,
?said Doug Milner, Ziptronix CEO. 揅ustom engineered substrates will enable ne
w RF device applications. Wafer-scale, hermetic MEMS encapsulation moves a cri
tical packaging step back into the fab and unleashes new, low-cost configurati
ons,?he said.
The company's technology ensures a uniform covalent bond across the wafer inte
rface and has been independently certified to exceed MIL-STD-883E hermetic lea
kage specifications.
Ziptronix projects costs of less than $200 per wafer pair, in production quant
ities.
--
一念不起为坐,见本性不乱为禅;
外不著相,内不乱为定
外禅内定,故名禅定,即时豁然,还得本心…….
※ 来源:·哈工大紫丁香 bbs.hit.edu.cn·[FROM: 218.9.121.63]
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